< BK21 플러스 BEST 정보기술 사업단 세미나 개최 안내 >

개최일시 : 2016년 11월 11일 금요일 17:00 ~ 18:30

개최장소 : 제 3공학관 C616호

세미나 제목 : Silicon Integrated High-density Electrocortical Interfaces

발표초록 :

Recent interest and initiatives in brain research have driven a worldwide effort towards developing implantable neural interface systems with high spatiotemporal resolution and spatial coverage extending to the whole brain. Electrocorticography (ECoG) promises a minimally invasive, chronically implantable neural interface with resolution and spatial coverage capabilities that, when appropriately scaled, meet the needs of recently proposed brain initiatives. Current ECoG technologies, however, typically rely on cm-sized electrodes and wired operation, severely limiting their resolution and long-term use.

Our work has advanced micro-electrocorticography (ECoG) technologies for wireless high-density cortical neural interfaces in two main directions: flexible active ECoG arrays; and modular fully integrated ECoG systems. I will present a systematic design methodology which addresses unique design challenges posed by the extreme densities, form factors and power budgets of these fully implantable neural interface systems, with experimental validation of their performance for neural signal acquisition, stimulation, and wireless powering and data communication. Notable innovations include 1) first demonstration of simultaneous wireless power and data telemetry at 6.78 Mbps data rate over a single 13.56 MHz inductive link; 2) the first fully integrated and encapsulated wireless neural-interface-on-chip microsystem for non-contact neural sensing and energy-replenishing adiabatic stimulation delivering 145 A current at 6 V compliance within 2.25 mm3 volume.

강연자 : 하소명 교수/ NYU, Abudabi

초청자 : 전기전자공학과 교수 김태욱