< BK21+ BEST Seminar Series Announcement> 

Time and Date : 16:00 ~ 17:30 Tuesday 10/02/2018

Place : D406, Engineering Building #4

Title : Die-Stacking: Evolution, Present, and Futures

Abstract:

Die-stacking technology has been considered for decades, but has only recently gained significant traction in high-volume commercial products. In this talk, I will start with an overview of today's current semiconductor technology environment with a focus on the trends and pressures that have opened the doors for die stacking. I will then describe die-stacking technology itself including wafer processing and through-silicon vias (TSVs). The remainder of the talk then shifts toward architecture applications of the technology. We paint a spectrum of possible architecture approaches based on TSV density, walk through some examples of die stacking in current systems, and then cover future directions, challenges, and key research opportunities related to die stacking for computer architectures.

Presenter: Gabriel H. Loh, Fellow Design Engineer / Advanced Micro Devices, Inc.

Host: Prof. Ro, Won Woo, Yonsei EEE