- 세미나 [10/02] Die-Stacking: Evolution, Present, and Futures
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< BK21 플러스 BEST 정보기술 사업단 세미나 개최 안내 >
개최일시 : 2018 년 10월 02일 화 16:00 ~ 17:30
개최장소 : 제4공학관 D406호
세미나 제목 : Die-Stacking: Evolution, Present, and Futures
Die-stacking technology has been considered for decades, but has only recently gained significant traction in high-volume commercial products. In this talk, I will start with an overview of today's current semiconductor technology environment with a focus on the trends and pressures that have opened the doors for die stacking. I will then describe die-stacking technology itself including wafer processing and through-silicon vias (TSVs). The remainder of the talk then shifts toward architecture applications of the technology. We paint a spectrum of possible architecture approaches based on TSV density, walk through some examples of die stacking in current systems, and then cover future directions, challenges, and key research opportunities related to die stacking for computer architectures.
강연자 성함&직함 / 소속 : Gabriel H. Loh, Fellow Design Engineer / Advanced Micro Devices, Inc.
초청자 : 전기전자공학과 교수 노원우